Insights

Technical noteGlass substrates

Full-length PDA bonding that closes the central adhesion gap for long-term glass via reliability

Glass vias metallized by double-sided sputtering bond only at the entry and exit, leaving an adhesion gap in the middle. This Technical Note uses a Corning patent and thermal cycling literature to examine how that gap becomes a damage path under repeated thermal deformation, and compares it with a PDA full-length bonding structure that extends the bond to the via center.

November 4, 2026

Technical noteGlass substrates

Reliability test methods for glass via interconnects, centered on IST and solder float

This Technical Note sets out how to test the durability of interconnects and interfaces in copper-filled through-glass vias with double-sided wiring. It centers on IST and solder float and also covers reflow, thermal cycling, temperature-humidity testing and failure analysis.

November 3, 2026

Technical noteGlass substrates

Extending sputtered seed connection depth in glass vias through the metal percolation threshold on polymer interfaces

This Technical Note reviews research on when sputtered metal becomes electrically connected on a polymer surface and applies it to sputtered seed layers in PDA-coated glass vias. It covers a connection-depth calculation and an integrated process design.

November 2, 2026

Technical notePlating

The PDA surface chemistry that puts copper on PTFE

This Technical Note explains how a PDA coating lets electroless copper form on PTFE, a surface copper does not readily adhere to, in order: dopamine's functional groups, the reactions that form PDA, follow-on reactions of the remaining groups and the copper plating bath.

November 1, 2026

Technical notePlating

Raising bottom-up fill speed in glass vias through sidewall contact angle

For glass vias sealed at the bottom with copper foil, this Technical Note describes a process design that makes the sidewalls hydrophilic with PDA to help the plating solution penetrate, raising the allowable current density for bottom-up filling and shortening plating time.

October 30, 2026

Technical notePlating

Electroless copper plating that starts on PDA instead of a catalyst

This Technical Note compares electroless copper plating on insulating substrates by Sn/Pd catalyst activation and by direct PDA·DMAB copper metallization, covering the differences in process steps, nucleation and the adhesion interface.

October 28, 2026

Technical noteGlass substrates

Filling glass core vias with copper paste instead of electrolytic plating

This Technical Note examines filling the via cores of glass core substrates by copper paste filling and sintering instead of electrolytic copper growth. It describes a design that uses PDA separately on copper particles and on the via wall, and the resulting manufacturing process.

October 24, 2026

Technical noteGlass substrates

Defects in electroless copper seeds on metal-oxide adhesion layers and what to verify

For electroless copper on metal-oxide adhesion layers used in through-glass via metallization, this Technical Note reviews papers and patents on the internal defects of the copper seed and the effects of heat treatment, which must be checked separately from adhesion to glass.

October 22, 2026

Technical notePlating

A hydrophilic PDA surface that lets bubbles leave blind vias

Bubbles cling to the walls of blind vias when they are filled with solution and when the solution is exchanged by nanoflushing. This Technical Note explains the problem through the hydrophilicity of PDA-coated surfaces and the way bubbles detach from them.

October 21, 2026