About Cools
Cools resolves the productivity and reliability bottlenecks of AI semiconductor packaging with core technologies in glass packaging, semiconductor bonding, thermal control and power semiconductors.
Technology fields
Glass packaging and TGV
Through-glass via metallisation and glass-to-metal bonding for glass substrates and interposers.
See the solutionSemiconductor bonding
Thermal Clutch based thermocompression bonding and photothermal hybrid bonding.
See the solutionThermal control and dissipation
Cooling and heat dissipation structures for packages and modules.
See the patentsPower semiconductors and SiC
Bonding and heat dissipation for silicon carbide power devices and modules.
See the patents
At every step of stacking, bonding and cooling a chip, we rewrite the limits of heat and the interface.
Overview
- Company
- Cools Co., Ltd.
- Founded
- April 2026
- CEO
- Jinhyeon Cho
- HQ
- 23 Jungdong-buk-ro, Uichang-gu, Changwon-si, Gyeongsangnam-do, Korea
- Branch
- 160 Samsung 1-ro, Dongtan, Hwaseong-si, Gyeonggi-do, Korea
- TEL
- +82-10-2280-9414
- contact@cools.co.kr
- Business
- IP licensing, module and component supply, equipment and process solutions
