The technologies and the adoption paths with which Cools clears the bottlenecks of semiconductor packaging.
HBM thermocompression bonding
More than half of a thermocompression bonding cycle is cooling. The pace was set by air convection; we hand it to solid conduction.
A cooling device for bonding equipment. It lifts the cooling body away while the head is heating so no heat is lost, then puts it back in contact once the bond is complete to draw the heat out.
First validation cut the bonding cycle by 51% (7.0 to 3.4 seconds, measured, at equal bond quality).
See the related patents
Technical notePower semiconductorsEven after AI racks move to high-voltage DC distribution, a low-voltage, high-current conversion stage remains just ahead of the GPU. This Technical Note looks at moving that stage closer to the load as a cooling-structure problem. The full report is available in Korean. An English summary is provided on this page.
Technical noteThermal controlThis Technical Note addresses the warpage and component tilt that arise when copper posts and MLCCs mounted together on a wafer are reflowed in one laser step. It describes a process that uses a light-transmitting upper head to support the parts and remove heat.
Technical noteThermal controlThis Technical Note examines how warpage left after molding disturbs solder ball mounting and board-level joints in fine-pitch FCCSP. It describes a process that restores flatness outside the mold through reheating, pressing and constrained cooling.
Glass packaging
Interface delamination, microcracks and fill defects are what hold glass substrates back from volume production. All of them start where glass and copper fail to bond.
It builds a continuous interface down the full sidewall of a through-glass via first, then propagates the electrode along it in sequence, so the metallisation comes out without voids.
379 related patents filed.
See the related patents
Technical noteGlass substratesThis Technical Note examines filling the via cores of glass core substrates by copper paste filling and sintering instead of electrolytic copper growth. It describes a design that uses PDA separately on copper particles and on the via wall, and the resulting manufacturing process.
Technical noteGlass substratesFor electroless copper on metal-oxide adhesion layers used in through-glass via metallization, this Technical Note reviews papers and patents on the internal defects of the copper seed and the effects of heat treatment, which must be checked separately from adhesion to glass.
Technical notePlatingBubbles cling to the walls of blind vias when they are filled with solution and when the solution is exchanged by nanoflushing. This Technical Note explains the problem through the hydrophilicity of PDA-coated surfaces and the way bubbles detach from them.
Three ways to adopt, starting with the one that keeps the most of your existing equipment.
Way 1
We supply functional modules and parts, such as the Thermal Clutch, into your existing equipment. The lowest upfront cost.
Ask about modulesWay 2
We provide equipment and process solutions with thermal control and metallisation built in.
Ask about equipmentWay 3
We license the patented technology to semiconductor and equipment companies.
Ask about licensing