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Cooling is where a TC bonder cycle loses its time. Cools replaces the path heat escapes through, so throughput and thermal budget stop competing.

Cooling is the bottleneck

Cooling is over half the cycle, and the equipment makers say so themselves. The bond arm has to fall from bonding temperature back to standby before the next die, and gas convection sets how fast that can happen.

260°C60°C
  • Heating  2.0s
  • Bonding  2.0s
  • Cooling  5.0s
One bonding cycle, 9.0s. ASMPT states the bond arm takes more than 5 seconds to cool from above 260°C to around 60°C, and calls that cool-down a bottleneck of the TCB process (US10014272). Heating ramp of 100°C/s is Intel at ECTC 2014. Hold time is illustrative. Reported TC-NCF bonding runs 2 to 10 seconds per layer as of 2026.

Instead of cooling harder, Cools replaces the path the heat escapes through. Gas convection gives way to solid conduction.

Throughput and thermal budget, together

Both are bound to the same cooling time constant. Shorten it and both improve. There is no trade to make.

  • Throughput

    More units per hour

    A shorter cycle means the bonder finishes more parts in the same shift.

  • Thermal budget

    Less time at temperature

    Accumulated thermal exposure falls because the part spends less time hot.

Adoption paths

Sunk cost is the strongest source of resistance, so the paths are ordered by how little you have to give up first.

  • Path 1

    Drop-in cooling module for existing bonders

    Keep your bonders, replace only the cooling unit. The lowest sunk-cost entry point.

    Ask about a retrofit

  • Path 2

    Co-development of dedicated equipment

    Designing the cooling structure from scratch with equipment makers.

    Ask about co-development

  • Path 3

    IP licensing

    Licensing a patented portfolio.

    Ask about licensing

Technologies

Each technology has a standing definition page that papers and press can cite.

  • SOL-02

    Thermal Clutch

    Detaches the cooling body during heating to block heat loss, then engages at bond completion to absorb heat through solid conduction.

    Explore the Thermal Clutch

  • SOL-03

    To be defined

    A second technology page is reserved. The subject is still being scoped with Cools.