A doctor of heat transfer engineering who spent 28 years on thermal management at Samsung Electronics.
2,713 (September 19, 2026 )
A corporate research organisation solves problems with hundreds of engineers. Cools starts one step earlier, at defining which problem is worth solving, and keeps the rights to the answer.
The latest insights published by Cools.
Technical noteSolarThis Technical Note describes a structure that replaces the body of a solar cell's front collecting electrode, the part that sets silver usage, with copper. It sets out an electrode design and process that split the roles among PDA adhesion, copper wiring and a Ni-based diffusion barrier.
Technical notePrinted electronicsThis Technical Note addresses how roughening for adhesion raises high-frequency conductor loss on the low-loss PTFE and LCP substrates used for smartphone RF feed lines and antennas. It describes smooth metallization that bonds copper through a PDA interface instead of roughening.
Technical notePrinted electronicsThis Technical Note describes printing a PDA pattern on the substrate first so that only the places that need circuitry become adhesion and metallization areas. It sets out the two metallization routes, electroless plating and paste printing, that branch from the same PDA pattern.
