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KOEN

Rethinking how semiconductors are cooled.

The Thermal Clutch replaces the heat escape path from gas to solid, improving bonder throughput and accumulated thermal exposure together.

Our 1,900+ patents
Meet the Founder

The Thermal Clutch detaches the cooling body during heating to block heat loss, then engages precisely at bond completion to absorb heat through solid conduction.

Explore the Thermal Clutch

Solutions

Three ways to adopt, ordered by how little you have to give up first.

All solutions
  • Drop-in cooling module for existing bonders

    Keep your bonders, replace only the cooling unit. The lowest sunk-cost entry point.

    Ask about a retrofit
  • Co-development of dedicated equipment

    Designing the cooling structure from scratch with equipment makers.

    Ask about co-development
  • IP licensing

    Licensing a patented portfolio.

    Ask about licensing