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Vision

The basis of competition is moving from owning equipment to managing cycle time and thermal history. That is why now.

Why now

Access barriers to back-end equipment have come down. As they do, what separates one line from another is no longer which bonder it owns, but how it manages cycle time and accumulated thermal history. Cooling sits at the center of both.

Where the ground is open

  • Equipment access

    Access barriers to back-end equipment have opened. Entry no longer depends on owning the bonder.

  • Process know-how

    What used to live inside a few lines is being transferred and documented.

  • Cooling principle

    A solid-conduction cooling principle for bonding has not formed anywhere yet. This is the open ground.

Standards in motion

JEDEC is reviewing a package height revision from 775 to 900 micrometers, and next-generation HBM die areas keep growing. Both push more heat through the same bond line.

The market

Advanced packaging is projected to grow from 46 billion dollars in 2024 to 79.4 billion by 2030.

Source: Yole Group, as cited by inews24, May 2026.

Roadmap

  1. 01 Near term

    Validate the cooling module on existing bonders.

  2. 02 Mid term

    Co-develop dedicated equipment with makers, designing the cooling structure in from the start.

  3. 03 Next generation

    Lead the cooling spec of the next TC bonder standard.

Where the principle extends

  • 2.5D interposer bonding
  • Heterogeneous chiplet integration
  • Hybrid bonding