News
Press releases, coverage, and activities, newest first.
- Coverage“The HBM (AI chip) packaging race is a contest over how much you can bond, with how little damage”Kookje Shinmun
- Coverage“PDA coating can solve the conformal plating problem in glass substrates”KIPOST
- Coverage“The bottleneck in HBM back-end is heat”: Cools develops technology that cuts bonding time by 51%Edaily
- CoverageCan 10-second bonding revive NVIDIA’s four-GPU package?ICViews
- CoverageHas the biggest hurdle for glass substrates been cleared? From glass-copper bonding to TGV platingTHE ELEC
- CoverageCools develops a low-warpage bonding technology for very large AI packagesTHE ELEC
- CoverageCools points to TGV metallization as the bottleneck in glass substrate mass productionTHE ELEC
- CoverageCools SPEA: Korean Breakthrough in Glass Substrate Plating for AI ChipsIntelligent Living
- CoverageCools to unveil new glass substrate technology for AI chips, extending to large-area glass interposersStartupN
- CoverageThermal control startup Cools joins IBK Changgong Busan's 15th startup cohortMoney Today