Cools, a glass substrate platform company, has identified through-glass via (TGV) metallization as the central obstacle to mass production of glass substrates. Its argument is that the main reliability problems seen in glass substrates, including semiconductor warpage-related defects, interfacial delamination and micro-cracks, all begin with incomplete bonding between glass and copper.
"The root cause of every problem now appearing in glass substrates is the failure to properly bond glass and copper during TGV metallization," CEO Jinhyun Cho said on September 4. "The two materials have to form a chemically stable interface, not merely sit in physical contact."
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