Cools, a semiconductor packaging company, has developed a bonding technology that suppresses warpage in very large artificial intelligence (AI) chip packages. A high-stiffness lid constrains package warpage while the Thermal Clutch shortens heating and cooling time. The approach is aimed at bonding defects that arise in very large packages such as Nvidia's next-generation AI accelerator, Rubin Ultra.
Cools said on September 16 that it had developed a bonding technology for very large semiconductor packages that combines a high-stiffness lid with its own Thermal Clutch. The lid, normally attached at the final packaging stage for heat dissipation once the die and interposer have been bonded, is instead joined before bonding.
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