Cools, an advanced semiconductor packaging company, will unveil its through-glass via (TGV) metallization and via-filling technology, a process regarded as central to glass substrates for AI chips. The company plans to present a technology platform that extends from panel-level glass core substrates to glass interposers.
Cools said on August 19 that CEO Jinhyun Cho will speak at the seminar 'CPO and Advanced Packaging: The Core of AI Semiconductor Performance' on August 27 at Suwon Convention Center.
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