On August 24, the English-language technology outlet Intelligent Living reported on SPEA (Self-Propagating Electrode Architecture), Cools’ metallization technology for glass substrates.
The article explains that SPEA aims to fill high-aspect-ratio through-glass vias (TGV) with copper without voids or entrance pinch-off, combining a functional interface that improves metal-to-glass adhesion on the via wall with a bottom-up fill that starts from a seed electrode at the base.
It carries the company’s account of reduced entrance closure and internal voiding and of scalability to panel-level processing, along with the number of filed patents in glass substrate packaging and CEO Cho Jin-hyun’s presentation at a seminar held at Suwon Convention Center on August 27.
Note: the original article spells the company name as "Kools". The correct spelling is Cools.