In an interview broadcast by THE ELEC on September 22, Cools CEO Cho Jin-hyun discussed metal bonding on glass substrates and the metallization of through-glass vias (TGV).
The program opens with why metals adhere poorly to glass, then covers the polydopamine (PDA) interfacial layer Cools derived from mussel adhesive proteins and its SPA plating method, which fills vias from the bottom up. It also addresses adhesion testing and customer validation, a business model centered on patents and royalties, and plans to extend the technology to glass interposers and HBM bonding.
The video was released on THE ELEC’s YouTube channel on September 24.