As the center of gravity in AI chip competition shifts to back-end processes that bond multiple chips quickly and reliably, a packaging company is unveiling a method that raises process efficiency by applying heat only where it is needed.
Semiconductor packaging technology company Cools said on October 18 that it will give an oral presentation at the International Symposium on Microelectronics and Packaging (ISMP 2026), to be held on November 4 at the Paradise Hotel in Haeundae, Busan. The presentation covers a selective energy coupling platform that applies to both HBM (high bandwidth memory) thermocompression bonding and co-packaged optics (CPO) bonding. The method delivers the heat needed for bonding only to the bond interface and only at the moment it is needed, rather than to the whole package, raising speed while reducing heat exposure of surrounding structures.
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