As competition in the artificial intelligence (AI) chip market shifts to advanced packaging, Cools, a company specializing in semiconductor bonding and thermal control, has put forward an answer to the heat problem long identified as a bottleneck in HBM (high bandwidth memory) manufacturing.
Cools said on October 13 that it will give an oral presentation on its selective energy coupling platform at the International Symposium on Microelectronics and Packaging (ISMP 2026), to be held on November 4 at the Paradise Hotel in Busan.
The platform applies to both HBM thermocompression bonding and next-generation CPO (co-packaged optics) bonding. Its core idea is to deliver heat only to the bond interface, and only at the moment it is needed, rather than to the whole package, raising process speed while minimizing thermal damage to surrounding structures.
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