On September 30, the Chinese semiconductor outlet ICViews examined whether Cools’ bonding technology could revive NVIDIA’s next-generation four-GPU large-format package, a design held back by warpage and process efficiency.
The article describes the approach in two stages: attaching a high-stiffness lid before bonding and holding pressure until the solder fully solidifies, then using the Thermal Clutch to handle the thermal mass the lid adds. During heating the path to the cooling side is blocked; once bonding ends, the path switches to cooling.
It cites figures of heating and cooling time cut from over a minute to under 10 seconds, and post-bond warpage held below 0.1 mm, on a 180 x 70 mm class package.
The piece goes on to discuss the implications for AI chip design, competition among bonding equipment makers, foundry and OSAT strategy, and the Chinese packaging industry.
Note: the original article spells the company name as "Kools". The correct spelling is Cools.