About this document
Glass package substrates and glass interposers differ in via size and wiring density but share the same manufacturing principle. This technical note covers the point at which moving to large areas changes the reliability requirement itself, and the trade-off in conventional TGV metallization that forced a choice between film continuity and access to the deep interior.
Download
An English edition is not available yet. The Korean document is below.
Summary
As glass packaging moves to large-area panels, the task in TGV metallization has shifted from plating an individual via to securing the reliability of every via. Conventional approaches had to choose between film continuity and access to the deep interior, and reliability differs with how defects are distributed even at the same average coverage. The note sets out two structures that first secure interfacial continuity and then propagate the electrode sequentially, together with their range of application. It is the presentation given at the ASPS 2026 SMTA seminar, with a list of 57 glass packaging patents appended.
Conclusion
A discontinuity is not simply uncovered area; it is a crack initiation site that already exists. At the same defect area ratio, the more the defects are dispersed, the greater the total crack front length, and locally unbonded regions lead to crack propagation and delamination through thermomechanical stress concentration. Reliability calls for a continuous interface, not a high average coverage. Solving interfacial continuity is only the first half of the problem. Making the whole surface an electrode causes the upper and lower openings to close early and leaves a void in the middle. Voids arise not from insufficient plating but from the absence of electrode topology control. The Self-Propagating Electrode Architecture (SPEA) keeps the interface continuous throughout while activating the electrode sequentially as the metal grows. Metal growth begins at a defined electrode at the bottom, the latent interface that the metal touches becomes an electrode, and the electrode boundary advances from bottom to top as a single front. Once access and interfacial continuity are decoupled from line-of-sight deposition, aspect ratio stops being a defining bottleneck and becomes a scaling variable. PLP glass core substrates and very large glass interposers sit on a single metallization platform, so there is no need to choose between them.
Topics
- Glass substrates
- Packaging
