Jinhyun Cho, CEO of Cools, will give an oral presentation at ISMP 2026 on November 4. The abstract was accepted for oral presentation through peer review, under the title 'Thermal Clutch and Optical Clutch: Selective Energy-Coupling Platforms for HBM Bonding and Co-Packaged Optics'.
ISMP, the International Symposium on Microelectronics Packaging, is an international conference hosted by the Korean Microelectronics and Packaging Society (KMEPS), now in its 24th year. The 2026 edition runs from November 3 to 6 at Paradise Hotel Busan.
The Cools presentation is scheduled for the Bump Bonding session at 9:20 a.m. on November 4. It covers an approach that applies the same principle to two different processes: thermocompression bonding for HBM and co-packaged optics.
Presentation details
- Title: Thermal Clutch and Optical Clutch: Selective Energy-Coupling Platforms for HBM Bonding and Co-Packaged Optics
- Presenter: Jinhyun Cho, CEO of Cools
- Conference: ISMP 2026 (24th International Symposium on Microelectronics Packaging)
- Host: Korean Microelectronics and Packaging Society (KMEPS)
- Dates: November 3-6, 2026
- Venue: Paradise Hotel Busan
- Presentation time: Wednesday, November 4, 09:20-09:40
- Session: A. Bump Bonding (O1-02)