Jinhyun Cho, CEO of Cools, will give an oral presentation at ISMP 2026 on November 4. The abstract was accepted for oral presentation after review, under the title 'Thermal Clutch and Optical Clutch: Selective Energy-Coupling Platforms for HBM Bonding and Co-Packaged Optics.'
ISMP (International Symposium on Microelectronics Packaging) is an international conference hosted by the Korean Microelectronics and Packaging Society (KMEPS), now in its 24th edition. The 2026 conference runs for four days, from November 3 to 6, at Paradise Hotel Busan.
The presentation is scheduled for 9:20 a.m. on November 4 in the Bump Bonding session. It covers an approach that applies the same principle to two different processes: HBM thermocompression bonding and co-packaged optics integration.
Presentation details
- - Title: Thermal Clutch and Optical Clutch: Selective Energy-Coupling Platforms for HBM Bonding and Co-Packaged Optics
- - Presenter: Jinhyun Cho, CEO of Cools
- - Conference: ISMP 2026 (24th International Symposium on Microelectronics Packaging)
- - Host: Korean Microelectronics and Packaging Society (KMEPS)
- - Dates: November 3-6, 2026
- - Venue: Paradise Hotel Busan
- - Presentation: November 4, 09:20-09:40
- - Session: A. Bump Bonding (O1-02)
