Reports, briefs and technical notes from Cools on semiconductor packaging technology and industry.
Technical notePhotonicsIn heterogeneous silicon photonics integration, each added material exposes heat-sensitive optical devices to the bonding temperature again. This Technical Note sets out the principle, process and equipment of interface-selective bonding, which converts light into heat only at the designed bond interface. The full report is available in Korean. An English summary is provided on this page.
Technical noteCPOThis Technical Note addresses the two places where heat becomes a problem in co-packaged optics: the EIC–PIC bonding process and the thermo-optic tuners inside the PIC. It describes how the heat path is designed for each location. The full report is available in Korean. An English summary is provided on this page.
Technical noteThermal controlIn a COUPE structure, the heat is needed at the bonding interface between the EIC and the PIC. Oven annealing instead puts heat into the entire assembly, including the support silicon and the optical devices. This technical note sets out what that difference changes in a structure whose optical paths and coupling alignment are sensitive to heat. The full report is available in Korean. An English summary is provided on this page.