Reports, briefs and technical notes from Cools on semiconductor packaging technology and industry.
BriefPackagingPlacing several GPU dies and multiple HBM stacks on a single interposer is driving package area up sharply. The moment the area grows, warpage moves to the front of the bonding process. This brief sets out how constraining the package shape and cutting heating and cooling time fit together.
BriefThermal controlAdvanced packaging demands a fast reaction at the bond interface while allowing an ever lower thermal budget for the structures around it. The two demands conflict. Instead of heating and cooling the whole assembly, this brief sets out an approach that switches where energy couples in space and time, applied to two processes: HBM bonding and CPO integration.
BriefThermal controlIn March 2026 a Korean equipment maker disclosed plans to supply 2.5D thermocompression bonders to foundries in China and Taiwan. This brief marks the point at which back-end competition shifts from owning equipment to managing cycle time, and sets out the physical reason the bottleneck sits in the cooling segment after bonding.