BriefThermal control
Thermal Clutch
A thermal control module that detaches the cooling body during heating to block heat loss, then engages precisely at bond completion to absorb heat through solid conduction.
서멀클러치 / Thermal Clutch / 热离合
Where the air jet reaches its ceiling
The gap is set by the working fluid itself. Raising the flow rate does not close it, because vibration and particles constrain bonding precision before the thermal gain arrives.
| Air jet | Solid conduction | |
|---|---|---|
| Thermal conductivity | 0.026 to 0.037 W/m·K | 170 to 400 W/m·K |
| Interface coefficient h | 500 to 1,000 W/m²K | 20,000 to 50,000 W/m²K |
The interface coefficient differs by about 40x. Estimated by Cools from the ranges above.
How one cycle works
01
Detach
During heating and pressing, the cooling body stays separated so no heat leaks out of the bond line.
02
Engage
At bond completion, the cooling body makes precise contact with the bond head.
03
Absorb
Heat crosses the solid interface into the cooling body.
04
Discharge
The absorbed heat leaves through a short discharge path.
05
Detach again
The body separates before the next cycle begins heating.
Why a clutch
Solid contact is good for cooling and bad for heating. A cooling plate that stays in contact cannot work. The clutch exists so the same interface can be there at one moment and gone the next.
Performance
Measured results and design targets are stated separately, each with its condition. They are not the same kind of number.
| Metric | Value | Status | Condition |
|---|---|---|---|
| Cooling segment | 7.0 s to 3.4 s (51%) | Measured | First validation equipment, at equal bond quality |
| Cooling per bond | 4 s to 0.5 s | Design target | When interface contact reaches the required condition, typical TCB cycle |
| Bonder throughput | Up to 3x | Design target | Depends on the share of cooling in the full cycle |
| Accumulated thermal exposure | About 85% lower | Design target | For multi-layer stacking |
Fitting an existing bonder
Two pipes, one valve channel
The module mounts on an existing TCB bonder with two pipes and a single valve channel. It runs without electric power.
The recipe stays
Bonding recipes and underfill are untouched. The same module covers HBM3E and HBM4.
Not to be confused with TIM
Thermal Clutch
A device. It connects and disconnects the heat path on demand.
Thermal interface material
A material. It stays in the interface at all times.