Summary
JEDEC is reviewing a package height revision from 775 to 900 micrometers. What that implies for heat through the bond line.
JEDEC is reviewing a package height revision from 775 to 900 micrometers. What that implies for heat through the bond line.
How to cite
Cools (2026). JEDEC package height revision and what it implies Cools Insights in-2026-005. https://cools.co.kr/en/insights/in-2026-005/
Topics
- HBM